ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,965, issued on Sept. 15, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.). "Thermoplastic interposer" was invented by ... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,966, issued on Sept. 15, was assigned to ZTE Corp. (Shenzhen, China). "Shielding structure and circuit board" was invented by Jinlong Li (... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,967, issued on Sept. 15, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore). "Core resonance suppression in sign... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,968, issued on Sept. 15, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Multilayer dielectric substrate and method fo... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,969, issued on Sept. 15, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan City, Taiwan). "Collapse-free circuit structure with low capa... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,970, issued on Sept. 15, was assigned to CoreLED Systems LLC (Livonia, Mich.). "Illuminated signage and badges" was invented by John Kahl ... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,971, issued on Sept. 15, was assigned to Google LLC (Mountain View, Calif.). "Sheet metal waterproof design for flex sealing" was invented... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,972, issued on Sept. 15, was assigned to KYOCERA Corp. (Kyoto, Japan). "Wiring board" was invented by Hidetoshi Yugawa (Kyoto, Japan). Ac... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,973, issued on Sept. 15, was assigned to SAFRAN (Paris). "Member for interconnecting electrically a printed circuit board and at least one... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,974, issued on Sept. 15, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Power module" was inv... Read More